Study of the influence of surface-active substances on the initial stage of copper electrodeposition
In this research, the effect of surface-active substances (CMC and DFP) on the electrolysis of copper by cyclic voltammetry (CVA) and chronoamperometric methods was studied. The working electrode was a glassy carbon electrode. Studies show that in the acid solution of copper sulfate (10-2 M CuSO4 + 0.5 M H2SO4), the three-dimensional electrochemical deposition of copper occurs by the mechanism of instantaneous nucleation. The added surface active substances affect the dischargeionization process, the standard electroreduction potential is shifted to the negative side. The added DFP reduces the cathodic peak current, and the addition of CMC results in its increase. At the deposition potentials corresponding to the regions up to the CVA peak current (here, still, the mixed electrodeposition kinetics), the number of nuclei formed is greater for a pure solution, but at current decay potentials, where the diffusion regime takes place, the nuclei population density (NPD) is higher for solutions with surfactants. The most powerful effect here is caused by the addition of DFP. In the case of mixed additives, the NPD values are close to those of the CMC, obviously indicating the preferential adsorption of CMC, whereas the DFP as complexes with copper ions is closer to the near-electrode region.
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